Characterization and Metrology
Leica INM 200 Optical Microscope
This is the new Leica INM 200 Optical Microscope system. It is newly designed as a universal inspection microscope, having both reflected and transmitted light imaging capability. In addition, it has extensive image processing software enabling the user to optimize the image, including the ability to greatly extend the depth of focus of high resolution images by digitally combining image slices through the depth of a feature, as shown in the composite image of a device (below). It also features a motorized z-axis stage and protected auto focus. It has a video camera for real time display of images and a very high resolution digital camera which enables a digital zoom capability from a captured image. In general, this microscope serves a wide user base requiring high resolution planar lithography to MEMS features with extreme topology.
Leica INM 100 Optical Microscope
This microscope is a manual, high-performance optical microscope designed for the Semiconductor industry. It is equipped with a nominal CCD camera and a computer system to capture the images – top side illumination only. It is capable of magnifying to 2000x using an extra magnification lens in its body. The microscope has multiple modes of producing images: 1) Bright Field illumination, 2) Dark field illumination, 3) Interference contrast, and 4) Fluorescence imaging. This is used as a utility microscope which can capture images via a digital video camera system. This object has no metrology capability.
Zeiss Supra 40 Scanning Electron Microscope
This scanning electron microscope is a multiple use object that has many features. It is capable of imaging resolution of 1-2 nm, it has an EDAX X-Ray spectrometer to determine what elements are present in the image and can map the location of the elements over the image. It has both secondary electron and backscattered electron detectors for common SEM imaging as well as material sensitive imaging. It has an Electron Back-Scatter Diffraction Detector which, via software analysis can determine lattice parameters of various materials. It even has a Scanning Transmission Electron Microscope system to obtain images of thin sections by sending electrons right through the sample and detecting an image from underneath the sample. For device characterization, we have a Zyvex nano-manipulator stage and a low-noise semiconductor characterization system. This system has piezo driven probes with extremely sharp points for contacting and or manipulating nano-sized devices. This system is student operated after extensive training by Cleanroom staff.
Veeco Dimension 5000 SPM
The Cleanroom AFM is a Veeco, Model 3100 Dimension V Atomic Probe Microscope, fondly called our AFM for short. The principal upon which this object images a surface is that it scans a very sharp probe point across a sample surface and monitors the vertical movement of the probe. Multiple scans are collected into a graph until a topographical image emerges. Because of the sharp point and precision objecting, this system can image and measure features as small as single atomic plane steps in a crystal surface. It is heavily used to measure feature depths, lengths, widths, surface roughness, and image highly magnified surface features. In particular, the tapping mode of operation follows the surface with the probe tip oscillating up and down, just tapping the surface, which lessens the likelihood of scratching a trench in the surface, so it is ideal for soft surfaces like polymer materials and delicate nano structures – by the way, it also works on hard surfaces.
The Sentech 800 is an automated spectroscopic ellipsometer that can measure thickness, refractive index, and absorption properties of multi-layer thin film stacks. The spectral range of its Xenon arc lamp source is in the 350 nm – 850 nm UV-Visible range. which is ideal for most semiconductor materials. The object is operated by a comprehensive software package, called SpectraRay, that controls data acquisition, modeling, fitting, and reporting of ellipsometric data.
Jandel Multiposition Wafer Probe
The Jandel multiposition wafer probe can measure either the resistance or sheet-resistance at several locations on wafers up to 6 inches in diameter.
Alessi 4-point Probe
The Alessi manual 4 point probe uses a Cascade C4S probe head with 1mm spacing between tungsten carbide probe tips.
The metering is provided by a QuadTech LR2000 digital milliohmmeter.
Thermo Electron FTIR Spectrometer w/Ge ATR
Info coming soon.
TOHO FLX2320 Thin Film Stress Measurement
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well known mathematical relation is then used to calculate the stress of the thin film.
Veeco Dektak VIII Profilometer
The Dektak 8 profilometer measures the vertical profile of developed or etched patterns by lightly dragging a sharp stylus across the surface and detecting its vertical movement. This allows users to determine resist thickness, etch depth, and general step height distances. Vertical sensitivity is in the fractions of an Angstrom (0.01 nano-meters). It uses a general purpose stylus with a 12.5 micron radius. This system is highly automated but quite user friendly, and can measure features anywhere on a substrate up to 8 inches in diameter.
Nanometrics Nanospec 6100 Thin Film Thickness Analyzer
The NanoSpec 6100 thin film thickness measurement system utilizes non-contact spectroscopic reflectometry to measure sites as small as 25 µm in diameter on reflecting substrates. The object measures film thicknesses in the range of 200 Å – 20 µm with the visible light source and 25 Å – 20 µm with the UV light source. Substrates up to 200 mm in diameter can be measured on the system. It uses a computerized sample stage and an auto focus system to rapidly generate 2D and 3D film thickness uniformity maps and statistics. These features are very useful for optimizing the uniformity of thin film deposition and etch processes. The object is also capable of measuring multiple layers if the optical constants of the materials are known.