Characterization and Metrology
Oxford Asylum Research Jupiter XR Atomic Force Microscope
A new AFM to replace the retired Veeco Dimension V SPM that was retired in July 2020. The Jupiter XR was released to our users for operation on August 10, 2020. A guide for users wanting to perform tapping mode AFM can be found here
This new tool comes with advanced technologies for AFM in the cleanroom lab, including BlueDrive laser technology for establishing stable and low-noise tapping frequencies, Z sensor imaging capabilities for sub 100 nm features, and hardware specifically engineered for fast scan modes that enable high throughput data collection. Generally, the UTD cleanroom user base utilizes tapping mode AFM, but other modes for electrical and force measurements are available on the the instrument. More information about the capabilities and advanced imaging modes of the Jupiter XR can be found on the Oxford Asylum website.
This tool is capable of scanning samples ranging in size from a few square mm up to a 200 mm wafer. Large area scans up to 100 um x 100 um, and high resolution images of features from 12 um to less than 1 nm can can be accomplished with this instrument. The noise spec for this tool is 100 pm.
There is an additional computer workstation in the cleanroom office area that is set up with the Oxford/Asylum software. This workstation allows users to view and process AFM data using the same software as the instrument, without incurring usage fees on the instrument. A UTD NetID is required to log into this computer. If a user has a computer that is running Igor 6.37, the Oxford/Asylum software is available as a free downloadable plug-in. Alternatively, data from the AFM (with a .ibw file extension) can be viewed and processed on Gwyddion
This is a manual goniometer used for measuring the contact angle of a static drop of water on the surface of a solid sample. The contact angle gives the user an idea of how hydrophobic or hydrophillic a sample surface is, which may be very useful when attempting to optimize adhesion between two dissimilar materials. This manual is written by the tool manufacturer, and is a useful supplement to the engineer-authored manual found on this website.
DM05 Leica INM 200 Optical Microscope
This is the new Leica INM 200 Optical Microscope system. It is newly designed as a universal inspection microscope, having both reflected and transmitted light imaging capability. In addition, it has extensive image processing software enabling the user to optimize the image, including the ability to greatly extend the depth of focus of high resolution images by digitally combining image slices through the depth of a feature, as shown in the composite image of a device (below). It also features a motorized z-axis stage and protected auto focus. It has a video camera for real time display of images and a very high resolution digital camera which enables a digital zoom capability from a captured image. In general, this microscope serves a wide user base requiring high resolution planar lithography to MEMS features with extreme topology.
DM01 Leica INM 100 Optical Microscope
This microscope is a manual, high-performance optical microscope designed for the Semiconductor industry. It is equipped with a nominal CCD camera and a computer system to capture the images – top side illumination only. It is capable of magnifying to 2000x using an extra magnification lens in its body. The microscope has multiple modes of producing images: 1) Bright Field illumination, 2) Dark field illumination, 3) Interference contrast, and 4) Fluorescence imaging. This is used as a utility microscope which can capture images via a digital video camera system. This object has no metrology capability.
DM07 Zeiss Supra 40 Scanning Electron Microscope
This scanning electron microscope is a multiple-use object that has many features. It is capable of imaging resolution of 1-2 nm, it has an EDAX X-Ray spectrometer to determine what elements are present in the image and can map the location of the elements over the image. It has both secondary electron and backscattered electron detectors for common SEM imaging as well as material sensitive imaging. It has an Electron Back-Scatter Diffraction Detector which, via software analysis can determine lattice parameters of various materials. It even has a Scanning Transmission Electron Microscope system to obtain images of thin sections by sending electrons right through the sample and detecting an image from underneath the sample. For device characterization, we have a Zyvex nano-manipulator stage and a low-noise semiconductor characterization system. This system has piezo-driven probes with extremely sharp points for contacting and or manipulating nano-sized devices. This system is student-operated after extensive training by Cleanroom staff.
In Spring 2020, the SEM was upgraded with new hardware from EDAX. These upgrades include an Octane Elect EDS (energy dispersive spectroscopy) system and a DigiView EBSD (electron backscattering diffraction) camera. For instruction on how to set up for EDS, please refer to this guide. For a 10 minute-long introduction to the new EDS software, see here.
Woollam M2000D Ellipsometer (WVASE32)
This tool is an automated spectroscopic ellipsometer that can measure thickness, refractive index, and absorption properties of multi-layer thin film stacks. The spectral range of its Xenon arc lamp source is in the 350 nm – 850 nm UV-Visible range. which is ideal for most semiconductor materials. The hardware is operated by a comprehensive software package that controls data acquisition, modeling, fitting, and reporting of ellipsometric data.
Jandel Multiposition Wafer Probe
The Jandel multiposition wafer probe can measure either the resistance or sheet-resistance at several locations on wafers up to 6 inches in diameter.
DP03 Alessi 4-point Probe
The Alessi manual 4 point probe uses a Cascade C4S probe head with 1mm spacing between tungsten carbide probe tips.
The metering is provided by a QuadTech LR2000 digital milliohmmeter.
DA01 Thermo Electron FTIR Spectrometer w/Ge ATR
Info coming soon.
DS01 TOHO FLX2320 Thin Film Stress Measurement
The FLX-2320 is a thin film stress machine. A laser scanner is used to measure the changes in the radius of curvature of the substrate caused by the deposition of a thin film on the wafer. This is accomplished by first measuring the wafer curvature before the film is deposited and then re-measuring the curvature after the film is deposited. A well known mathematical relation is then used to calculate the stress of the thin film.
Veeco Dektak VIII Profilometer
The Dektak 8 profilometer measures the vertical profile of developed or etched patterns by lightly dragging a sharp stylus across the surface and detecting its vertical movement. This allows users to determine resist thickness, etch depth, and general step height distances. Vertical sensitivity is in the fractions of an Angstrom (0.01 nano-meters). It uses a general purpose stylus with a 12.5 micron radius. This system is highly automated but quite user friendly, and can measure features anywhere on a substrate up to 8 inches in diameter.
DT05 Nanometrics Nanospec 6100 Thin Film Thickness Analyzer
The NanoSpec 6100 thin film thickness measurement system utilizes non-contact spectroscopic reflectometry to measure sites as small as 25 µm in diameter on reflecting substrates. The object measures film thicknesses in the range of 200 Å – 20 µm with the visible light source and 25 Å – 20 µm with the UV light source. Substrates up to 200 mm in diameter can be measured on the system. It uses a computerized sample stage and an auto focus system to rapidly generate 2D and 3D film thickness uniformity maps and statistics. These features are very useful for optimizing the uniformity of thin film deposition and etch processes. The object is also capable of measuring multiple layers if the optical constants of the materials are known.