Plasma-Therm ICP-Metal Etch
The Plasma-Therm plasma ICP etcher is configured for etching metallic films using chlorine based chemistries. Presently, Cl2, BCl3, O2, and Ar are installed on the object. The object is equipped with a vacuum load-lock to prevent potentially toxic etch by-products from venting to the Cleanroom during sample load and unload.
Plasma-Therm, Plasma Dielectric & Deep Silicon Etch
The PLASMA-THERM, formerly Oerlikon, plasma dielectric and DSE (Deep Silicon Etch) etcher is configured for etching films using fluorine based chemistries. Presently, SF6, CHF3, and C4F8 precursors are installed on the object. The object is equipped with a vacuum load-lock to prevent potentially toxic etch by-products from venting to the Cleanroom during sample load and unload.
Plasma-Therm III-V’s Etcher
The Plasma-Therm III-V’s etcher is configured for etching III-V’s compound semiconductors using chlorine and fluorine based chemistries. Presently, Cl2, BCl3, HBr, CHF3, SF6, CH4, O2, N2, H2, He, and Ar are installed on the object. The object is capable of sample heating up to 180C and is equipped with an end-point detection and thickness monitoring system.
Technics Reactive Ion Etcher
The Technics Reactive Ion Etcher creates a directional high energy gas plasma to etch materials.
Oxygen is used to remove carbon based materials and CF4 is used to remove silicon based materials.
The March Asher, (PX-250), is a batch etch object designed for a multiplicity of plasma process applications. The electrodes and sample plates can be quickly rearranged to create direct plasma, reactive ion etch, and down stream plasma conditions for different applications. This system consists of three modules: a Reaction Chamber, a Process Controller Module and a solid state RF power generator. The reaction chamber is accessed by a double front door equipped with a window in the inner door for viewing the etch progress. The process controller monitors and sequences the variable parameters of the plasma process, including chamber pressure, RF power, process timing and gas flow rates. We normally operate the system in its Automatic mode, simply changing the parameter limits as needed.
At UTD, the system is normally used to “de-scum” photoresist with an O2 RIE plasma after develop and before etch to improve etch uniformity. Occasionally the electrodes are switched to create a direct plasma or a downstream plasma for chemical etching with little or no bombardment assist from the RIE configuration.