Surface Chemistry

SpinRinseDryer

Avenger Basic Dual Chamber Spin Rinse Dryer

The Avenger Basic Spin Rinse Dryer is a dual chamber wafer washer system with 3” and 4” diameter substrate capabilities. The substrates are held in a standard Teflon wafer boat that is balanced along with the rotor frames by the manufacturer. This means that you can only spin your substrates using the designated boat or an identical substitute. The system can run any of 5 different spin rinse programs. There are two basic default programs set into the microprocessor memory: Program “0” is a spin-only dry program and Program “1” is a rinse and subsequent dry program. This object is run by a microprocessor behind a touch screen, so programs can be easily changed and assigned to a spinner module.

Tousimis

Tousimis Supercritical Dryer

The Tousimis Supercritical “Automegasamdri” Model 815B Series C Critical Point Drier (CPD) is a system for drying typically MEMS devices after sacrificial layer etch or samples with high aspect ratio photoresist features.  If the HF etchant was rinsed with water and dried in atmosphere, the surface tension of the water could pull structures such as cantilevers into contact with other parts resulting in bonding which would not allow movement of the MEMS part.  The CPD process uses liquid CO2 to displace the transfer fluid (usually alcohol that replaced the HF etchant), and then takes the pure CO2 fluid to high temperature and high pressure to circumvent the critical point on the phase diagram and then returns to normal atmospheric conditions.  This technique avoids any capillary forces that could damage delicate features on the substrate.

 

Samco

Samco UV Ozone Stripper/Cleaner

The Samco Deep UV cleaner is a  system using 185 nM and 254 nM energy with Oxygen or Ozone to remove compounds from the surface of a substrate.  This can result in an atomically clean surface.  Typically, most of the compounds (photoresist, etchant masks) will be removed with a chemical stripper.  The DUV cleaner is only used for the last few percent of compound left.

The Samco has many operational variables, heat, time, oxygen, ozone, DUV light.  All of these may be combined or run singly.

AcidHood_000

Acid Hood

The Acid Hood is designed for the safe handling and disposal of acidic liquids only. It is constructed of chemical and fire resistant white plastic with a 3 by 2.5 foot working surface. The hood features a temperature controlled hot plate, a deionized-water sink and faucet, DI water and nitrogen spray guns, and two process timers.

AcidHood_000

Base Hood

The Base Hood is designed for the safe use of basic liquids only. It is constructed of chemical and fire resistant white plastic with a 3 by 2.5 foot working surface. The hood features a temperature controlled hot plate, a deionized-water sink and faucet, DI water and nitrogen spray guns, and two process timers.

RCAHood

RCA Hood

The RCA Hood is designed for the safe handling and disposal of RCA silicon wafer cleanup solutions. It is constructed of chemical and fire resistant white plastic with a 5.5 by 2.6 foot working surface. The hood features four temperature controlled cleanup baths, two cascade rinse tanks, a deionized-water sink and faucet, DI water and nitrogen spray guns, and three process timers.

SolventHood

General Solvent Hood

The General Solvent Hood is designed for the safe handling and disposal of organic solvents only. It is constructed of stainless steel with a 5 by 2.5 foot working surface. The hood features a temperature controlled hot plate, three solvent tanks, a solvent drain, a deionized-water sink and faucet, DI water and nitrogen spray guns, and two process timers.

SolventHood

Solvent Hood

The Solvent Hood is designed for the safe handling and disposal of organic solvents only. It is constructed of stainless steel with a 3 by 2.5 foot working surface. The hood features a temperature controlled hot plate, a deionized-water sink and faucet, a solvent tank, an ultrasonic tank, DI water and nitrogen spray guns, and two process timers.