Thermal Processing

JetFirst

Jetfirst 200 Rapid Thermal Processor

The JetFirst 200 is a halogen lamp heated Rapid Thermal Process system that is capable of rapidly  heating samples from ambient up to 1200 C. The object is provided with closed loop temperature control set by either a thermocouple or optical pyrometer. The reaction chamber can accommodate wafers up to 200 mm in diameter with the option of either a silicon or silicon carbide susceptor. Available chamber ambients are argon, nitrogen, oxygen, forming gas, or vacuum. A software interface provides easy recipe programming and monitoring of the system.

December 2009 Calibrations
ExoticsRTP1

MPTC RTP – 600 Rapid Thermal Processor

The MPTC RTP-600 is a compact, single-wafer, desk-top rapid thermal process system that is capable of rapidly heating samples from ambient up to 1200 C. The object features an easily interchangeable quartz heating chamber with closed-loop temperature control and programmable Time-Temperature profiles. The reaction chamber is configured to hold 100 mm wafers. The UTD Cleanroom has two of these objects. One unit is plumbed with nitrogen and oxygen and the other with nitrogen and forming gas.

MiniBrutes

Minibrute Atmospheric Furnace

The four-stack Thermco MiniBrute atmospheric furnace system provides basic oxidation and annealing capabilities needed for electron device fabrication on wafers up to 100 mm in diameter. The system is presently configured to allow either O2, 10% O2 + 90% N2, N2, or forming gas to be delivered to tubes 2 and 3. The two bottom tubes are restricted to silicon-only processing. The bottom tube, which is used only for silicon oxidation, can also be connected to a steam generator for wet oxidation processes. The top tubes are designated for general use.

Process Data

Control Charts

MOSCAP Data

TystarFurnace

Tystar Diffusion/Oxidation Furnace

The new four-stack Tystar atmospheric furnace system provides basic oxidation and annealing capabilities needed for silicon transistor and MEMS fabrication on wafers up to 150 mm in diameter. The system is presently configured with two oxidation tubes and two tubes for solid-source diffusion and annealing of N and P type dopants. The furnaces are fully computer-controlled and feature automated load/unload stations and remote recipe editing and download.

Process Data

Control Charts

MOSCAP Data